| Hymec Microelectronics
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| Specialized in the field of hybrid microelectronics using chip-and-wire, surface mount and flipchip technology. Site includes virtual plant tour. Netherlands. |
| Hytel Group Inc
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| Electronics assembly including thick film, surface mount, chip and wire, flip chip, BGAs, CSPs and electrical test. Facilities in Chicago area and Beijing, China. |
| IBS Technology International HK Ltd
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| Mobile communication design and manufacturing, specialize in rf components and design for gsm, gps, fiberoptics. |
| IEC Electronics Corp
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| Provides electronics manufacturing services including new product introduction, design and test engineering and quick-turn, prototype, flexible volume and mix manufacturing. Online capability statements and RFQ. |
